Thermal interface silicon material is one kind of heat transfer pad, to reduce the thermal resistance between heat source and heatsink, specify
using the gap to transfer the heat, also help on insulating, sealing and shaking. It is widely used in Electronic products such as PCB board, motor
interal or exteral assembly, lots of equipment, automobile, computer, notebook, DVD, VCD ect use it for heat dissipating.
Basing different thermal conductivity, Adcol separate our materials as below:
Adcol reserve the right to amend product design and specification, subject to alteration without prior notice.
